Joining metals using a low‑melting alloy, commonly used in electronics.

• A. Welding
• B. Adhesive bonding
• C. Soldering
• D. Powder coating

Answer: (C)

Joining metals with a low-melting alloy used in electronics is soldering. The key idea is that the filler metal (solder) has a melting point well below the metals being joined. When heated, the solder liquefies and flows into the joint by capillary action, bonding parts together without melting the base metals themselves. This lets you make electrical connections and mechanical joints on delicate components without exposing them to high heat. Flux is often used to clean surfaces and improve wetting, helping the solder spread and adhere properly. The resulting joint conducts electricity and provides enough strength for many electronic applications, though it’s not as strong as a welded joint, which fuses the base metals. Other methods like welding (melts base metals), adhesive bonding (glue), or powder coating (a surface finish) don’t fit the description of using a low-melting filler alloy to join metals.